NXP Semiconductors signs €360.0 million unsecured loan facility with European Investment Bank
NXP B.V., a subsidiary of NXP Semiconductors N.V., entered into a €360.0 million unsecured senior loan facility with the European Investment Bank on January 13, 2025. The proceeds are expected to fund research, development and innovation of semiconductor devices, technologies and solutions in five European countries, and the loans carry a maximum tenor of six years.
Key points
- Facility size: €360.0 million unsecured senior loan from the European Investment Bank, signed January 13, 2025
- Borrowings may be in U.S. dollars or euros, at fixed or floating rates with a floor of zero
- Obligations fully guaranteed by NXP Semiconductors N.V., NXP Funding LLC and NXP USA, Inc.
- Maximum loan tenor of six years; covenants and events of default are generally consistent with the company's August 26, 2022 revolving credit agreement
The filing
Written by AI on Nov 8, 2026, 1:42 AM ET, from this filing only. Written later: this filing was briefed after the fact, when past filings were added to the site, so the brief may be read with hindsight; the filing itself is the record of what was known on January 13, 2025.
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